Ahmedabad-based entrepreneur Rehan Mansuri has launched Micronex, a startup that plans to manufacture semiconductor lead frames at Sanand in Gujarat with an investment of Rs 80 crore, according to an official statement reported by Times of India. The facility is expected to begin production by May 2027 and target annual output of 50 crore units in its first phase.
Micronex signed a memorandum of understanding with Kaynes Semicon during Semicon India 2026 in New Delhi earlier this month. The agreement could enable the company to supply lead frames to semiconductor manufacturers as Gujarat develops its domestic electronics and chip-production ecosystem.
Lead frames are thin metal structures used to mount semiconductor chips and connect them electrically to external circuits. Gold or copper wires connect the chip to the leads, while the frame is subsequently connected to a circuit board. The component also supports heat dissipation and protects chips during manufacturing.
The company plans to manufacture copper-alloy lead frames with thicknesses ranging from 0.1 millimetres to 0.25 millimetres. Micronex said local production would allow it to work directly with manufacturers on tooling, sampling and design modifications, while helping them meet inventory requirements more quickly.
Construction of the manufacturing facility has already begun, the official statement said. Once operational, the project is expected to generate direct employment for around 250 people. Micronex will initially target the power electronics and automotive sectors, with plans to expand into consumer electronics and telecom as its production capacity grows.
The project places Sanand’s industrial zone within the expanding supply chain for semiconductor-related manufacturing. The company also plans to seek approval under the India Semiconductor Mission 2.0 programme, although the statement did not specify the status or outcome of that application.
Micronex’s planned output and investment will make the facility a new manufacturing node for a component that sits between chip production and the assembly of electronic products. Its ability to supply manufacturers will depend on the completion of construction, production beginning as planned and the company’s proposed engagement with semiconductor customers.
The next stated milestones are the completion of the Sanand facility, the proposed application under India Semiconductor Mission 2.0 and the targeted start of production in May 2027.
