Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies, has partnered with US-based BroadPak Corporation to develop advanced semiconductor packaging capabilities in India, including a proposed facility for 2.5D and 3D packaging, chiplet integration and outsourced semiconductor assembly and testing.
The technology partnership, announced on Friday, is aimed at supporting applications linked to artificial intelligence, data centres, high-performance computing, networking and strategic electronics. Paras said the proposed facility would focus on heterogeneous integration and 3D packaging through an OSAT model.
The planned capabilities include wafer-level and panel-level fan-out packaging, hybrid bonding, through-silicon vias, micro-bumping, advanced interposers, redistribution layer technologies, co-packaged optics and high-end testing and reliability qualification. The company also identified optical and optronic systems as a target area for the facility.
Paras said the collaboration would combine its manufacturing ambitions in opto-electronics, photonics and co-packaged optics with BroadPak’s technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures. The proposed facility is intended to address high-volume manufacturing requirements as well as the needs of strategic electronics applications.
Advanced packaging allows different chips and components to be integrated into a single system, and has become increasingly important as conventional chip architectures face performance and efficiency constraints. In the partnership announcement, Paras Managing Director Munjal Sharad Shah described the company’s entry into semiconductors as a strategic expansion into a technology area critical to India’s AI, data centre and industrial capabilities.
BroadPak founder and chief executive officer Farhang Yazdani said advanced packaging was becoming central to the next generation of semiconductor innovation, particularly as AI and high-performance computing increased the demands placed on conventional chip architectures. He said India’s expanding semiconductor ecosystem created an opportunity to develop capabilities in heterogeneous integration and system-level packaging.
The announcement does not specify the proposed facility’s location, investment size, construction schedule, production capacity or commissioning date. It also does not state when commercial manufacturing or testing operations are expected to begin.
For India’s semiconductor ambitions, the proposed partnership addresses a part of the value chain beyond chip fabrication. The capabilities listed by Paras cover the assembly, integration, testing and qualification stages required to turn semiconductor components into higher-performance systems for computing, networking, optical and strategic applications. The companies are expected to develop the proposed facility through their technology collaboration, with further implementation details yet to be announced.
