The Union Cabinet has cleared India’s sixth chip manufacturing facility, set to come up in Jewar, Uttar Pradesh.
The project, backed by a joint venture between HCL Enterprise and Foxconn, will receive a capital investment of ₹3,706 crore. Expected to begin construction within months, the facility will focus on manufacturing display driver chips—critical components for smartphones, laptops, automobiles, and other electronics. With a monthly wafer processing capacity of 20,000, the unit aims to produce around 36 million chips every month once operational by 2027. Government sources said the project aligns with India’s broader push for technological self-reliance and comes at a time when global semiconductor demand continues to surge. The facility will not only reduce India’s dependency on chip imports but also contribute significantly to the Atmanirbhar Bharat mission.
Officials cited the growing ecosystem of semiconductor design and manufacturing in India, with several states working closely with global and domestic design firms. Jewar’s location was chosen for its strategic connectivity and infrastructure, alongside Uttar Pradesh’s aggressive industrial push. The collaboration will tap into HCL’s deep hardware engineering legacy and Foxconn’s global scale in electronics manufacturing. The government believes the fab will be a foundational asset for India’s future in AI, electronics, automotive tech, and digital infrastructure.
By expanding its semiconductor base, India aims to cement its position on the global chipmaking map and ensure long-term supply chain resilience.
